Isolast® PureFab™ Seals Produced and Packed in Cleanroom Environment

Isolast® PureFab™ Perfluoroelastomer

lsolast® PureFab™ offers the ultimate high purity, plasma sealing performance at high temperatures in critical semiconductor applications

The Isolast® PureFab™ range provides the best performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning, and thermal processing such as atomic layer deposition.

The range comprises of leading-edge Perfluoroelastomers (FFKMs) that offer unique properties including high-temperature stability, high purity, exceptionally low trace metal content, and outstanding plasma resistance. This leads to reduced particle generation and ultra-low outgassing performance in high vacuum conditions, enabling end-users to extend their product maintenance cycles while ensuring that process yield is maximized.

To ensure purity of product, all Isolast® PureFab™ seals produced and packed in a Class 100 (ISO5) cleanroom environment.

Trelleborg Sealing Solutions offers a unique and focused material portfolio to match process chemistry, system location and tool complexity:

  • lsolast® PureFab™ JPF10:
    • Fully organic structure
    • High purity
    • Excellent fluorine and oxygen radical plasma resistance
    • Low particle generation
    • High-temperature stability over +300 °C
    • Excellent chemical resistance, including in steam and amines
    • Suitable for processes including dry etching, stripping and remote plasma cleaning
  • lsolast® PureFab™ JPF20:
    • Advanced nanoparticle filler system providing minimal particle generation
    • Maximum resistance to aggressive ion and radical rich plasma chemistries
    • Excellent high-temperature stability to +320 °C
    • Suitable for use in all etch processes and critical tool locations where there is a requirement for extreme plasma resistance
  • Isolast® PureFabTM JPF21:
    • Proprietary filler system provides excellent oxygen plasma resistance and dimensional stability
    • Minimum particulation in NF3 plasma
    • Superior sealing force retention over long durations even at temperatures over +300°C extends seal life
    • Suitable for etch, deposition and diffusion processes
  • Isolast® PureFab™ JPF30:
    • Non-filled, translucent extreme purity material
    • Extremely low trace metal content
    • Unmatched thermal stability performance compared to competitors’ translucent materials, even at +300 °C
    • Suitable for ash and strip processes as well as applications that require low-sealing force 

Other materials in the Isolast® PureFab™ range:

  • Isolast® PureFab™ J9675:
    • Fully organic formulation with excellent resilience
    • Ultra-low outgassing performance for advanced node photolithography applications
    • Suitable for damping applications where outgassing properties are critical
  • Isolast® PureFab™ J9685:
    • Outstanding thermal resistance
    • Very low compression set
    • Operates in high-temperature thermal processes up to 325°C
    • Suitable for thermal processes such as ALD, oxidation/diffusion etc 
  • Isolast® PureFab™ J9610:
    • Superior chemical resistance for wet process applications
    • Very low extractables in aggressive wet process chemicals
    • Suitable for CMP, ECD and wet etch applications


  • O-Rings
  • Custom-designed seals including rubber-to-metal and rubber-to-plastic bonded products, such as wafer handling products
  • FlexiMold™ large-diameter joint free seals
  • Centering Rings (NW, KF, ISO)

Other Material Options: